片式电阻电子浆料的制备工艺与质量控制要点
片式电阻电子浆料的制备流程与质量保障 片式电阻的性能表现不仅取决于设计参数，更依赖于电子浆料的制备工艺水平。从原料选型到最终成品检测，每一个环节都需严格把控，才能确保产品的高性能与一致性。 1. 原料筛选与配比优化 选择高纯度、粒径分布均匀的金属粉末（如PdAg合金）是基础。通过激光粒度分析仪监控粒
Applications
我司在導體漿料與保護漿料已有一系列標準產品可供客戶選擇, 基於多年產品應用與材料應用的經驗,我們也能配合客戶在產品設計或製程設計的特殊需求開發客製漿料.
現有產品應用如下
-
圓片式被動元件電極
-
壓敏電阻
-
熱敏電阻
-
NTC感溫元件
-
PTC感溫元件
-
馬達火花消除元件
-
PZT壓電元件
-
片式天線
-
貼片式元件電極
-
晶片電阻
-
晶片電感
-
晶片NTC感溫電阻
-
晶片壓敏電阻
-
繞線電感
-
汽車除霧線
-
LED散熱基板
-
LTCC散熱基板
-
玻璃散熱基板
-
觸控面板
-
玻璃絕緣保護
-
太陽能電池
| APPLICATION | PRODUCT NO. | METAL% | FIRING TEMP. | DESCRIPTIONS |
|---|---|---|---|---|
| Disc type Passive Component | ||||
| JS9270 | 70%Ag | 540~700℃ | electrode for Zinc oxide varistor | |
| JS9278 | 75%Ag | 540~700℃ | electrode for Zinc oxide varistor | |
| JS9370 | 70%Ag | 700-800℃ | electrode for Power NTC | |
| JS9365 | 65%Ag | 700-800℃ | electrode for Power NTC | |
| JS9470 | 70%Ag | 700-800℃ | electrode for PZT | |
| JS9472 | 70%Ag | 700-800℃ | electrode for PZT | |
| JS9445 | 45%Ag | 700-800℃ | electrode for PZT | |
| JS9480 | 80%Ag | 700-800℃ | electrode for NTC sensor | |
| JS9670 | 70%Ag | 700-800℃ | electrode for NTC sensor | |
| JS9775 | 75%Ag | 700-800℃ | electrode for GPS | |
| JS9778 | 77.5%Ag | 600-700℃ | electrode for GPS | |
| JS9960 | 60%Ag | 780-820℃ | electrode for Disc Cspacitor | |
| JS6000 | Ag/Zinc | 440-600℃ | Omic electrode for PTC or SrTiO3 ring varistor | |
| JS6075 | 75%Ag | 440-600℃ | Cover electrode for PTC or SrTiO4 ring varistor | |
| JS9491 | 87%Ag | 300-400℃ | Solder layer on Ni for PTC or PZT | |
| JS6070 | 70%Ag | 700-800℃ | electrode for SrTiO4 ring varistor | |
| JS6184 | 84%Ag | 700-800℃ | electrode for SrTiO4 ring varistor | |
| JK6200 | Cu | electrode for Zinc oxide varistor | ||
| JK6900 | Cu | electrode for Disc Cspacitor | ||
| Chip Resistor | ||||
| JS8510 | 70% 99.5Ag/0.5Pd | 850℃ | Upside electrode C1 for chip resistor | |
| JS8517 | 70%Ag | 850℃ | Upside electrode C1 for chip resistor | |
| JS8516V | 60%Ag | 850℃ | Upside electrode C1 for chip resistor | |
| JS8515 | 70% 95Ag/5Pd | 850℃ | Upside electrode C1 for chip resistor | |
| JS8530 | 55%Ag | 850℃ | Backside electrode for chip resistor | |
| JS8534 | 43%Ag | 850℃ | Backside electrode for chip resistor | |
| JS8532 | 38%Ag | 850℃ | Backside electrode for chip resistor | |
| JG7051 | 600-620℃ | Chip R G1 | ||
| JG7026 | 600-620℃ | Chip R G2 | ||
| Inner electrode | ||||
| JS1230 | 50%Ag 50%Pd | 1200~1250℃ | Inner electrode for chip component | |
| JS1235 | 50%Ag 50%Pd | 1200~1250℃ | Inner electrode for chip component | |
| JS1275 | 30%Ag 70%Pd | 1230~1270℃ | Inner electrode for chip component | |
| JS1270 | 30%Ag 70%Pd | 1230~1270℃ | Inner electrode for chip component | |
| JS1150P | 70%Ag 30%Pd | 1100~1150℃ | Inner electrode for multilayer PZT | |
| Termination | ||||
| JS6063 | 63%Ag | 600℃ | Termination for chip component | |
| JS6560 | 60%Ag | 650℃ | Termination for chip component | |
| JS6563 | 63%Ag | 650℃ | Termination for chip component | |
| JS6569 | 69%Ag | 650℃ | Termination for chip component | |
| JS7063 | 63%Ag | 700℃ | Termination for chip component | |
| JS7563 | 63%Ag | 750℃ | Termination for MLCC or MLV | |
| JS8063 | 63%Ag | 800℃ | Termination for MLCC or MLV | |
| JS8070 | 70%Ag | 800℃ | Termination for MLCC or MLV | |
| Car window Glass | ||||
| JS9565 | 65%Ag | 600-800℃ | Defogger heater for real car window | |
| JS9575 | 75%Ag | 600-800℃ | Defogger heater for real car window | |
| JG7027 | 600-800℃ | Black Marking on Car window glass | ||
| Glass Substrate | ||||
| JS9178G | 78%Ag | 550-600℃ | glass heat sink for LED assembly | |
| JS9072P | 72%Ag | 550-600℃ | glass heat sink for LED assembly | |
| JS9078 | 78%Ag | 550-600℃ | via of glass heat sink for LED assembly | |
| JS9186PV2 | 84%Ag | 550-600℃ | glass heat sink for LED assembly | |
| JS9091 | 87%Ag | 300-400℃ | glass heat sink for LED assembly | |
| Touch Panel | ||||
| JS4570 | 70%Ag | 480-530℃ | Conductor for resistive or capacitive type touch panel | |
| JG4530 | 500~550℃ | Wave grid for surface wave touch panel | ||
| JS4591 | 87%Ag | 300-400℃ | Conductor for resistive or capacitive type touch panel | |
| LTCC/HTCC | ||||
| JS8590 | 90%Ag | 850~870℃ | LTCC Feed Through | |
| JS8586 | 86%Ag | 850~870℃ | LTCC Inner/cofire outer electrode | |
| JS8793V | 93% Solid | 850~870℃ | LTCC Feed Through | |
| JS8736 | 86%Ag | 850~870℃ | LTCC Inner/cofire outer electrode | |
| JS8732 | 82%Ag | 850~870℃ | LTCC Inner/cofire outer electrode | |
| JG1050 | 800~1600℃ | LTCC or HTCC filling carbon paste for chamber design | ||
| Alumina Substrate | ||||
| JS8486V2 | 84%Ag | 850~870℃ | Wire bond and high solder leaching resistance electrode on alumina substrate | |
| JS8587T | 87% | 850~870℃ | via electrode for eletrical plating on alumina substrate | |
| JS8570 | 70%Ag | 800~870℃ | electrode for eletrical plating on alumina substrate | |
| Passivation and Marking | ||||
| JG4530 | 440~550℃ | Green Marking or Insulator paste | ||
| JG4531 | 440~550℃ | Marking or Insulator paste | ||
| JG7026V2 | 620℃ | Chip R G2 | ||
| JG7051 | 600~620℃ | Chip R G1 | ||
| JG7057 | 760℃ | Transparent Insulator paste | ||
| JG7010 | 700℃ | White Marking or Insulator paste | ||
| JG7020 | 700℃ | Black Marking or Insulator paste | ||
| JG7006 | 650℃ | Black Marking or Insulator paste | ||
| JG7027 | 600-800℃ | Black Marking on Car window glass | ||
| JG7024 | 450-500℃ | Black Marking or Insulator paste | ||
| JG7025 | 550℃ | Black Marking or Insulator paste | ||
| JG7026 | 600-650℃ | Black Marking or Insulator paste (Chip R G2) | ||
| JG7022 | 200℃ | Black Marking or Insulator paste | ||
| JG7012 | 200℃ | White Marking or Insulator paste | ||
| JG7073 | 1150-1200℃ | Low TCE transparent Insulator paste | ||
| JG7073W | 1150-1200℃ | Low TCE white Insulator paste | ||
| JG7500 | 750℃ | Transparent Insulator paste | ||
| JG7502 | 750℃ | Black Marking or Insulator paste | ||
| Thinner | ||||
| JT9000 | Thinner for paste | |||
| JT9166 | Thinner for paste | |||
| JT9313 | Thinner for paste | |||
| JT9500 | Solvent for screen cleaning | |||
电子浆料相关资料
电子浆料在片式电阻中的应用及关键技术解析
电子浆料在片式电阻中的核心作用 电子浆料是现代片式电阻制造过程中不可或缺的关键材料，其性能直接决定了电阻的稳定性、精度和可靠性。片式电阻作为电子元器件中应用最广泛的被动元件之一，广泛应用于消费电子、通信设备、汽车电子及工业控制等领域。 1. 电子浆料的基本组成与特性 电子浆料主要由导电相（如钯银、铂
电子浆料的应用与发展趋势
在现代科技快速发展的背景下，电子浆料作为一种关键材料，在微电子、光电子、太阳能电池等领域发挥着不可替代的作用。电子浆料是一种具有导电性或半导体特性的复合材料，通常由金属粉末、玻璃粉、有机载体等组成，通过丝网印刷、喷涂或其他方法涂覆于基板上，经烧结后形成导电线路或电极。 电子浆料在微电子封装、厚膜电路
导电浆料
导电浆料又称导电胶，是贵金属粉与贱金属粉、 玻璃粉 和 合成树脂 的混合物。其中添加溶剂后可制成除料或石墨状物。金属粉的粒径约为 1~2um，正在开发的有粒径为几十nm的超微粉的浆料。实用的有Ag(30%~85%Ag